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By Mondon M., Berger S., Stadler H.

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19. F. F. Savage, G. M. Robelotto, “Studies of Upset Variables in the Flash Welding of Steels,” Welding Journal Research Supplement, 36(4): 192s– 216s (1957). 20. , Philadelphia, PA (1989). 21. F. Savage, “Flash Welding – Process Variables and Weld Properties,” Welding Journal Research Supplement, 41(3): 109s–119s (1962). 22. A. Munir, “A Theoretical Analysis of the Stability of Surface Oxides during Diffusion Welding of Metals,” Welding Journal Research Supplement, 62(12): 333s–336s (1983). 23.

This is especially the case with braze joints that are often used under a higher mechanical load than soldered joints; therefore, the formation of IMCs with a hard and brittle nature should be avoided. The practical selection of filler and base metals usually considers these criteria. In soldering, the use of tin-based lead-free solder has become a popular process, but the formation of Sn-containing IMCs is inevitable. 12 Relation between erosion depth of pure Cu and square root of holding time tested at 700–740°C using Cu-15Sn-7P filler metal.

Pb-based solders having a soft and ductile nature are used for die bonding. The replacement of Pb-based solder is preferable, however, no suitable alloys have been developed. WPNL2204 40 Microjoining and nanojoining Zinc-based and Cd-Zn solders are used for the joining of aluminium. Fluxless soldering is available for aluminum using ultrasonic application and zinc-based solders. Zinc-based solder shows severe erosion against aluminum, therefore furnace soldering of aluminium using Zn-based solders is not recommended.

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